Process capability
Process capability
Project Name | Process Capability |
---|---|
PCB Plate type | Through hole plate, HDI plate, flexible plate, rigid and flexible combined plate |
board | Conventional FR-4, high frequency and high speed materials |
Number of floors | Floors 1 to 32 |
Plate thickness | 0.4mm-10mm |
Maximum finished product delivery size | 570 * 1200mm |
Minimum finished product delivery size | 10 * 10mm |
Inner and outer base copper thickness | 1/3 OZ–6OZ |
Inner layer - minimum line width/spacing | 2.8/2.8mil (H/H OZ base copper) |
Outer layer - minimum line width/spacing | 3/3mil (H/H OZ base copper) |
Minimum BGA pad diameter | 8mil |
Minimum finished aperture | 16:1 |
Maximum plate thickness aperture ratio | 0.4mm-10mm |
PTH aperture tolerance | ±0.05mm |
Minimum solder bridge width | 3mil (green oil), 5mil(variegated ink) |
Plate bending and distortion | ≤0.5% |
Impedance tolerance | ±10% |
HDI board | Green, blue, white, black, red, yellow, green matte, black matte, blue matte |
Surface technology | Sunk gold, leaded spray tin, lead-free spray tin, OSP, sunk silver, sunk tin, nickel palladium gold |
Selective surface technology | Sinking gold +OSP, Sinking gold + Gold finger, sinking silver + Gold finger, sinking tin + Gold finger, with/without lead spray tin + Gold finger |
Special technology | Carbon oil, blue glue, long and short gold finger, deep control drilling, countersunk hole, horn hole, metal half hole, metal edge, back drilling, deep control gong blind slot, POFV, electroplating hole filling, etc |
Assistant
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