Process capability

Process capability

Project NameProcess Capability
PCB Plate typeThrough hole plate, HDI plate, flexible plate, rigid and flexible combined plate
boardConventional FR-4, high frequency and high speed materials
Number of floorsFloors 1 to 32
Plate thickness0.4mm-10mm
Maximum finished product delivery size570 * 1200mm
Minimum finished product delivery size10 * 10mm
Inner and outer base copper thickness1/3 OZ–6OZ
Inner layer - minimum line width/spacing2.8/2.8mil (H/H OZ base copper)
Outer layer - minimum line width/spacing3/3mil (H/H OZ base copper)
Minimum BGA pad diameter8mil
Minimum finished aperture16:1
Maximum plate thickness aperture ratio0.4mm-10mm
PTH aperture tolerance±0.05mm
Minimum solder bridge width3mil (green oil), 5mil(variegated ink)
Plate bending and distortion≤0.5%
Impedance tolerance±10%
HDI boardGreen, blue, white, black, red, yellow, green matte, black matte, blue matte
Surface technologySunk gold, leaded spray tin, lead-free spray tin, OSP, sunk silver, sunk tin, nickel palladium gold
Selective surface technologySinking gold +OSP, Sinking gold + Gold finger, sinking silver + Gold finger, sinking tin + Gold finger, with/without lead spray tin + Gold finger
Special technologyCarbon oil, blue glue, long and short gold finger, deep control drilling, countersunk hole, horn hole, metal half hole, metal edge, back drilling, deep control gong blind slot, POFV, electroplating hole filling, etc

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