Service

PCB Manufacturing

PCB form the backbone of electronic devices, but traditional PCB manufacturing techniques are reaching their limitations in providing what modern electronics demand. That's where high-density interconnect (HDI) printed circuit boards come in. Using advanced design and manufacturing techniques, HDI PCBs enable higher densities, speeds, and functionality within a compact footprint.

At Kevis, we offer HDI PCB manufacturing and assembly services, assisting our clients in realizing their most advanced electronic projects.

What are High-Density Interconnect PCBs?

High-density interconnect (HDI) printed circuit boards are advanced PCBs that incorporate technologies allowing for much higher component densities, finer circuit traces, and superior performance. Compared to traditional PCBs, HDI PCBs feature:

• Higher layer counts - HDI PCBs typically have 6 to 14 circuit layers stacked vertically. This provides more spaces for components and interconnects.
• Build-up technology - Additional dielectric and copper layers are deposited on the surface of HDI PCBs, creating extra interconnect levels.
• Finer circuit traces - HDI PCB traces can be as thin as 10-30 μm, allowing for denser routing between components.
• Microvias - Instead of plated through-holes, microvias with diameters under 100 μm provide vertical interconnects between circuit layers.
• Embedded passive components - Resistors, capacitors and inductors can be directly embedded within HDI PCB layers, further reducing board area needs.
• 3D interconnects - HDI PCBs utilize both vertical and horizontal circuit layers, maximizing density in 3 dimensions.
• Fine pitch SMT - HDI PCBs allow for very small pitch (0.3 mm or less) surface mount components, integrating more parts into limited space.

The result of using these advanced technologies is that HDI PCBs can contain 3 to 10 times as many components as traditional PCBs within the same footprint. This miniaturization enables the high performance, compact electronics that consumers demand today.

TSimulation - We utilize advanced EDA tools to simulate signal and power integrity, thermal performance, and EMC/EMI compliance of your HDI PCB design prior to manufacturing.

• Manufacturing - Our HDI PCB fabrication capabilities include:
• Layer counts up to 24 layers
• Trace widths down to 10 μm
• Microvia diameters as small as 30 μm
• Build-up technology with up to 8 dielectric layers
• Embedded passive components
• Rigorous testing to verify design requirements

Prototyping - We can produce small quantities of your HDI PCB design for validation and testing before moving into full production. PCB Assembly - Our SMT assembly capabilities include fine pitch components to 0.3 mm, allowing population of your HDI PCB designs. Full Turnkey Solutions - We work with you from initial concept through mass production to deliver the high performance HDI PCBs your product needs.

Conclusion

High Density Interconnect (HDI) PCB technology represents the next leap in electronic functionality, performance and miniaturization. At Kevis, we offer a full range of HDI PCB manufacturing and assembly services. Our team has extensive expertise in solving the unique challenges associated with HDI PCBS, allowing us to provide reliable, high-quality solutions that make your products stand out. If you have advanced electronics projects that require compact and high-performance PCBS, please do not hesitate to contact us.